[1]
Ailing Wang, Kai Zhong, Omer El Fakir, Chaoyang Sun, Liu, J. and Li-Liang Wang 2019. Springback Analysis of AA5754 under Warm Stamping Conditions. Engineering Science & Technology. 1, 1 (Dec. 2019). DOI:https://doi.org/10.37256/est.112020104.