AILING WANG; KAI ZHONG; OMER EL FAKIR; CHAOYANG SUN; LIU, J. .; LI-LIANG WANG. Springback Analysis of AA5754 under Warm Stamping Conditions. Engineering Science & Technology, [S. l.], v. 1, n. 1, 2019. DOI: 10.37256/est.112020104. Disponível em: https://ojs.wiserpub.com/index.php/EST/article/view/est.112020104.39-52. Acesso em: 6 may. 2024.