Ailing Wang, Kai Zhong, Omer El Fakir, Chaoyang Sun, Liu J, Li-Liang Wang. Springback Analysis of AA5754 under Warm Stamping Conditions. Engineering Science & Technology [Internet]. 2019 Dec. 30 [cited 2024 May 7];1(1). Available from: https://ojs.wiserpub.com/index.php/EST/article/view/est.112020104.39-52